Electronics Cooling and Packaging Engineering Design And Analysis
We are subject-matter experts in electronics cooling and electronics packaging. Contact us today!
Electronics Packaging Design
Prevent damage from heat, moisture, vibrations and dust with protective packaging.
Electronics Cooling Design
Reduce the risk of failures with the design and placement of
heat sinks, fans, and liquid cooling systems.
Thermal Managament
Control temperature and systems to ensure optimal performance, reliability, and safety.
Simulate Electronics Performance Under Various Heat Loads & Ambient Conditions
We bring a deep understanding and extensive experience of the principles and techniques involved in controlling temperatures and ensuring the safe and efficient operation of electronic devices and systems.
This includes extensive experience in
- Micro Channel Cold Plate Design
- Heat Exchanger Design
- Pumped Refrigerant System Design
- Single and Two-Phase Heat Transfer
- Transient Analysis
- Pressure Drop Analysis
- Computational Fluid Dynamics
- Thermodynamics
Simulate electronics performance under various heat loads and ambient conditions to ensure components are cooled enough to operate.
Leverage Our Expertise
Andy Johnston P.E., President, and Founder of Johnston Engineering, is considered a subject-matter expert in thermal management including two-phase flow and heat transfer with extensive experience in the analysis of single and two-phase flow (boiling and condensing) in microchannel cold plates and heat exchangers.
With 20+ years of experience in military and aerospace electronics cooling and packaging, Andy brings a wealth of knowledge in
the design and analysis of component and system-level thermal, fluid flow, and structural analysis to your project.
Packaging or Cooling Electronics?
We want to know your needs exactly so we can provide the perfect solution.
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