Electronics Cooling and Packaging Engineering

Electronics Cooling and Packaging

Electronics Cooling and Packaging Engineering Design And Analysis

We are subject-matter experts in electronics cooling and electronics packaging. Contact us today!

Schedule Consultation

Electronics Packaging Design

Prevent damage from heat, moisture, vibrations and dust with protective packaging.

Electronics Cooling Design

Reduce the risk of failures with the design and placement of heat sinks, fans, and liquid cooling systems.

Thermal Managament

Control temperature and systems to ensure optimal performance, reliability, and safety.

Simulate Electronics Performance Under Various Heat Loads & Ambient Conditions

We bring a deep understanding and extensive experience of the principles and techniques involved in controlling temperatures and ensuring the safe and efficient operation of electronic devices and systems.

This includes extensive experience in

Micro Channel Cold Plate Design
Heat Exchanger Design
Pumped Refrigerant System Design
Single and Two-Phase Heat Transfer
Transient Analysis
Pressure Drop Analysis
Computational Fluid Dynamics
Thermodynamics

Simulate electronics performance under various heat loads and ambient conditions to ensure components are cooled enough to operate.

Leverage Our Expertise

Andy Johnston P.E., President, and Founder of Johnston Engineering, is considered a subject-matter expert in thermal management including two-phase flow and heat transfer with extensive experience in the analysis of single and two-phase flow (boiling and condensing) in microchannel cold plates and heat exchangers.

With 17 years of experience in military and aerospace electronics cooling and packaging, Andy brings a wealth of knowledge in the design and analysis of component and system-level thermal, fluid flow, and structural analysis to your project.

Schedule Consultation